Name: International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Start: 2024-10-08
End: 2024-10-10

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WEBSITE :	https://event.asme.org/InterPACK
CONTACT PERSON :	Mary Jakubowski
EVENT ENQUIRIES EMAIL ADDRESS :	Not Available
DEADLINE FOR ABSTRACTS / PROPOSALS :	19th February 2024
ORGANIZED BY :	ASME

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

San Jose, United States

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